METHODS FOR PROCESSING A THIN FLEXIBLE GLASS SUBSTRATE WITH A GLASS CARRIER

摘要

A method of processing a thin flexible glass substrate is provided. The method may include the steps of (I) providing the glass carrier including a release area and a mount area; then (II) providing the release area of the glass carrier with a textured surface by contacting an etchant including an ammonium fluoride mixture to the release area for a period; then (III) removing the etchant from the glass carrier; and then (IV) bonding a mount area of the thin flexible glass substrate to the mount area of the glass carrier. The textured surface prevents a target area of the thin flexible glass substrate from bonding to the release area of the glass carrier.