发明名称 |
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE |
摘要 |
A reconstituted semiconductor package and a method of making a reconstituted semiconductor package are described. An array of die-attach substrates is formed onto a carrier. A semiconductor device is mounted onto a first surface of each of the die-attach substrates. An interposer substrate is mounted over each of the semiconductor devices. The interposer substrates are electrically connected to the first surface of the respective die-attach substrates. A molding compound is filled in open spaces within and between the interposer substrates mounted to their respective die-attach substrates to form an array of reconstituted semiconductor packages. Electrical connections are mounted to a second surface of the die-attach substrates. The array of reconstituted semiconductor packages is singulated through the molding compound between each of the die-attach substrates and respective mounted interposer substrates. |
申请公布号 |
EP2947683(A3) |
申请公布日期 |
2015.12.30 |
申请号 |
EP20150164662 |
申请日期 |
2015.04.22 |
申请人 |
BROADCOM CORPORATION |
发明人 |
LAW, EDWARD;ZHAO, SAM ZIQUN;HU, KUNZHONG;KHAN, REZAUR RAHMAN |
分类号 |
H01L21/56;H01L23/31 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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