CHEMICAL-MECHANICAL POLISHING COMPOSITIONS COMPRISING ONE OR MORE POLYMERS SELECTED FROM THE GROUP CONSISTING OF N-VINYL-HOMOPOLYMERS AND N-VINYL COPOLYMERS

摘要

Described is a chemical-mechanical polishing (CMP) composition comprising the following components: (A) surface modified silica particles having a negative zeta potential of −15 mV or below at a pH in the range of from 2 to 6 (B) one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers (C) water (D) optionally one or more further constituents, wherein the pH of the composition is in the range of from 2 to 6.