| 发明名称 |
SEMICONDUCTOR WAFER PROTECTIVE FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A) , in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9. |
| 申请公布号 |
SG11201509734Y(A) |
申请公布日期 |
2015.12.30 |
| 申请号 |
SG11201509734Y |
申请日期 |
2014.05.22 |
| 申请人 |
MITSUI CHEMICALS TOHCELLO, INC. |
发明人 |
MORIMOTO AKIMITSU;KATAOKA MAKOTO;FUKUMOTO HIDEKI |
| 分类号 |
H01L21/304;B32B27/30;C09J7/02;C09J133/00;H01L21/301 |
主分类号 |
H01L21/304 |
| 代理机构 |
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