ELECTROMECHANICAL DEVICE, GLASS-BASED DRIVER CHIP THEREFOR AND METHOD OF MANUFACTURING THE DEVICE

摘要

A device includes a first substrate formed of a first material and a plurality of electromechanical devices formed upon a surface of the first substrate. The device also includes an integrated circuit (IC) chip bonded to the surface of the first substrate where the integrated circuit chip is formed of a material selected from a group consisting of the first material or a material having a coefficient of thermal expansion (CTE) that is substantially similar to the CTE of the first material. In particular, both the first substrate and the chip substrate may be glass.