| 摘要 |
An intermediate connection layer (3) is interposed between a wiring substrate having a pair of land electrodes, and an electronic component. In the intermediate connection layer (3), first and second connection electrodes (11a, 11b) are formed on the surface of a base (10). A fuse part (9) is formed inside the second connection electrode (11b), that is, between one main conductor part (13) that is an opposite surface to a first external electrode (5a) and the other main conductor part (16) that is an opposite surface to a second external electrode (5b). Consequently, an electronic device capable of ensuring a desired fuse function without causing an increase in the size of the device itself is implemented. |
