| 摘要 |
The present invention relates to a device to be used for stable process temperature control in a semiconductor process and the like and, more specifically, to an attachment for controlling the temperature and flow rate of brine, provided closely to semiconductor equipment so as to precisely control the temperature of brine supplied from a chiller using a freezing cycle to the semiconductor equipment. The attachment for controlling the temperature and flow rate of brine, according to the present invention, cools the brine by exchanging heat with a coolant in a high-temperature operation mode. Therefore, power consumption can be reduced according to an unnecessary refrigerant cycle operation of a chiller. In addition, the flow rate of a coolant is controlled even during heat exchange with the coolant such that a heater operation for maintaining the temperature of brine required in semiconductor process equipment can be minimized. Furthermore, the attachment for controlling the temperature and flow rate of brine, according to the present invention, can easily be provided to conventional semiconductor process equipment. Moreover, the attachment for controlling the temperature and flow rate of brine, according to the present invention, can control the temperature and flow rate of brine. |
