| 摘要 |
<p>A backplane 100 to receive electrical components 200, for example a PCB to receive multiple hard disc drives (HDDs) and to be mounted in a sled, is configured to prevent transfer of vibrations between electrical components by allowing connector island(s) 109 located in opening(s) 110 in a substrate 103 to move independently with respect to the substrate. One or more flexible bridging elements 114 extend between the connector islands and the substrate, and backplane traces 106 formed as part of the substrate extend over the bridging elements 114 to the connector island(s) 109. The bridging elements allow the connector island(s) 109 to flex with respect to the substrate 103 and absorb vibrations. A mating connector component 122 may be permanently or removably affixed to a connector island. There may be a series of alternating connector islands 109 formed along two parallel axes extending lengthwise on the substrate, and each connector island may be able to move independently to other connector islands. The backplane may be trapezoidal, with fewer backplane traces at the narrower end, connecting to the farthest connector island from a backplane connector region (Fig. 8; 140).</p> |
