发明名称 |
Wiring board with built-in capacitor |
摘要 |
A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel. |
申请公布号 |
US9226399(B2) |
申请公布日期 |
2015.12.29 |
申请号 |
US201012952234 |
申请日期 |
2010.11.23 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
Tanaka Hironori |
分类号 |
H01G4/00;H05K1/16;H05K1/18;H01L23/498;H01L23/50;H05K1/11;H05K3/46 |
主分类号 |
H01G4/00 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A wiring board with built-in capacitors, comprising:
a core substrate; and a high dielectric sheet positioned on the core substrate and comprising a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer comprising a single sintered ceramic body in a form of a single film and sandwiched between the lower electrode layer and the upper electrode layer, at least one of the lower electrode layer and the upper electrode layer being partitioned into a plurality of electrodes such that the high dielectric sheet has a plurality of capacitors, wherein one of the lower electrode layer and the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel. |
地址 |
Ogaki-shi JP |