发明名称 Wiring board with built-in capacitor
摘要 A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the lower electrode layer and/or the upper electrode layer being partitioned into multiple electrodes such that the high dielectric sheet has multiple capacitors. The lower electrode layer and/or the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel.
申请公布号 US9226399(B2) 申请公布日期 2015.12.29
申请号 US201012952234 申请日期 2010.11.23
申请人 IBIDEN CO., LTD. 发明人 Tanaka Hironori
分类号 H01G4/00;H05K1/16;H05K1/18;H01L23/498;H01L23/50;H05K1/11;H05K3/46 主分类号 H01G4/00
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A wiring board with built-in capacitors, comprising: a core substrate; and a high dielectric sheet positioned on the core substrate and comprising a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer comprising a single sintered ceramic body in a form of a single film and sandwiched between the lower electrode layer and the upper electrode layer, at least one of the lower electrode layer and the upper electrode layer being partitioned into a plurality of electrodes such that the high dielectric sheet has a plurality of capacitors, wherein one of the lower electrode layer and the upper electrode layer is connected to a ground line and the other one of the lower electrode layer and the upper electrode layer is connected to a power line such that the capacitors are electrically connected in parallel.
地址 Ogaki-shi JP