发明名称 Porous alumina templates for electronic packages
摘要 Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.
申请公布号 US9226396(B2) 申请公布日期 2015.12.29
申请号 US201313797355 申请日期 2013.03.12
申请人 Invensas Corporation 发明人 Katkar Rajesh;Uzoh Cyprian Emeka;Haba Belgacem;Mohammed Ilyas
分类号 H05K1/09;H05K1/00;H05K1/16;H05K1/11;H05K7/10;H01L23/498;H01L21/48 主分类号 H05K1/09
代理机构 Lerner, David, Littenberg, Krumholz & Mentlik, LLP 代理人 Lerner, David, Littenberg, Krumholz & Mentlik, LLP
主权项 1. An interposer, comprising: a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, the connection elements consisting essentially of aluminum and being electrically isolated from one another by at least the alumina extending along the walls of the pores; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements, and wherein at least some of the pores are disposed adjacent one another in annular patterns, and at least some of the annular patterns encompass connection elements of the plurality of connection elements and the alumina extending along the walls of the pores of the at least some annular patterns electrically isolates respective connection elements from one another.
地址 San Jose CA US