| 发明名称 | Thermal management of electronic components | ||
| 摘要 | An electronic device comprises a multi-layer printed circuit board. On the printed circuit board there is installed electronic components and a metal frame that encloses at least part of the electronic components. A layer of bonded anisotropic conductive film is disposed on the frame and the electronic components. The layer connects thermally a sheet of metal foil on the frame and on the electronic components. The sheet of metal foil covers the electronic component and the metal frame. | ||
| 申请公布号 | US9224672(B1) | 申请公布日期 | 2015.12.29 |
| 申请号 | US201414573304 | 申请日期 | 2014.12.17 |
| 申请人 | Microsoft Technology Licensing, LLC | 发明人 | Pykäri Lasse;Saarinen Ilkka J.;Koskinen Matti T. |
| 分类号 | H01L23/34;H01L23/373;H01L23/367;H01L23/04;H01L23/043 | 主分类号 | H01L23/34 |
| 代理机构 | Zete Law, P.L.L.C. | 代理人 | Yee Judy;Minhas Micky;Zete Law, P.L.L.C. |
| 主权项 | 1. An electronic device comprising: a multi-layer printed circuit board; at least one first electronic component installed on the printed circuit board; a first metal frame installed on the printed circuit board, the first metal frame enclosing the at least one electronic component; and a first layer of bonded anisotropic conductive film on the first metal frame and the at least one first electronic component connecting thermally a sheet of metal foil on the first frame and on the at least first one electronic component, the sheet covering the at least one first electronic component and the first metal frame. | ||
| 地址 | Redmond WA US | ||