Semiconductor device and method for manufacturing the same

摘要

A semiconductor device of an embodiment includes a semiconductor layer formed of a III-V group nitride semiconductor, a first silicon nitride film formed on the semiconductor layer, a gate electrode formed on the first silicon nitride film, a source electrode and a drain electrode formed on the semiconductor layer such that the gate electrode is interposed between the source electrode and the drain electrode, and a second silicon nitride film formed between the source electrode and the gate electrode and between the drain electrode and the gate electrode and having an oxygen atom density lower than that of the first silicon nitride film.

主权项

1. A method for manufacturing a semiconductor device, comprising:
forming a first silicon nitride film on a semiconductor layer formed of a III-V group nitride semiconductor; forming a gate electrode on the first silicon nitride film; and forming a second silicon nitride film having a lower oxygen atom density than the first silicon nitride film on the semiconductor layer, on both sides of the gate electrode, wherein a hydrogen atom density of the first silicon nitride film is one digit or more lower than a hydrogen atom density of the second silicon nitride film.