Implant encapsulation

摘要

An implant unit may include a substrate and an implantable circuit arranged on the substrate. An encapsulation structure may be disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including a parylene layer and a silicon layer disposed over the parylene layer.

主权项

1. An implant unit, comprising:
a substrate; an implantable circuit arranged on the substrate; and an encapsulation structure disposed over at least a portion of the substrate and at least a portion of the implantable circuit, the encapsulation structure including: a first polymer layer having a first density; a second polymer layer disposed over the first polymer layer and having a density which is less than the first density; and at least one pair of modulation electrodes connected to the implantable circuit, wherein the first polymer layer includes a first window of exposure over one or more of the modulation electrodes, the first window of exposure having a first area; and wherein the second polymer layer includes a second window of exposure over one or more of the modulation electrodes and at least partially extending over the first window of exposure, the second window of exposure having a second area that is larger than the first area of the first window of exposure.