Semiconductor package

摘要

Semiconductor packages and associated techniques are described. A described semiconductor package includes a lead frame; a first wire bond; a second wire bond; a first voltage source to provide a first voltage; a second voltage source to provide a second voltage; a first die pad coupled with the first voltage source via the first wire bond; a second die pad coupled with the second voltage source via the second wire bond; a first die disposed on the first die pad; a second die disposed on the second die pad; and an encapsulant. The first die pad and the second die pad can be electrically isolated from each other such that the first die pad is maintainable at a first potential associated with the first voltage source and the second die pad is maintainable at a second potential associated with the second voltage source.

主权项

1. A semiconductor package, comprising:
a lead frame; a first die pad configured to operate at a first potential; a second die pad configured to operate at a second potential, wherein the second potential is different from the first potential, wherein the second die pad is situated apart from the first die pad, and wherein the second die pad is electrically isolated from the first die pad; a first die disposed on the first die pad; a second die disposed on the second die pad; a first wire bond connected with the first die pad and a first voltage source, which affects the first potential; a second wire bond connected with the second die pad and a second voltage source, which affects the second potential; and an encapsulant surrounding the die pads, the dice, the wire bonds, and at least a portion of the lead frame.