| 发明名称 | Electronic device and electrically-conducting assembly thereof | ||
| 摘要 | An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device. The first housing is detachably combined with the second housing. The electrically-conducting assembly includes a retaining wall and a lapping part. The retaining wall is perpendicularly provided at the first housing, and a surface of the retaining wall has an electrically-conducting layer. The lapping part is perpendicularly provided at the second housing, and a surface of the lapping part has another electrically-conducting layer. The lapping part and the retaining wall contact with each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive. | ||
| 申请公布号 | US9226434(B2) | 申请公布日期 | 2015.12.29 |
| 申请号 | US201314019974 | 申请日期 | 2013.09.06 |
| 申请人 | PEGATRON CORPORATION | 发明人 | Huang Su-Tai;Su Dun-Wei |
| 分类号 | H05K7/20;H05K9/00 | 主分类号 | H05K7/20 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. An electrically-conducting assembly for conducting a first housing and a second housing of an electronic device, the first housing being detachably combined with the second housing, the electrically-conducting assembly comprising: a retaining wall perpendicularly provided at the first housing, a surface of the retaining wall having an electrically-conducting layer; and a lapping part perpendicularly provided at the second housing, a surface of the lapping part having another electrically-conducting layer, the lapping part and the retaining wall contacting with each other when the first housing and the second housing are combined so that the electrically-conducting layer and the another electrically-conducting layer are mutually conductive, wherein the lapping part has a hole, the hole is formed adjacent to the second housing. | ||
| 地址 | Taipei TW | ||