Method for producing a wafer provided with chips

摘要

A method for producing a product wafer having chips thereon, comprising the steps of:
processing the first side of the product waferbonding the product wafer with its first side onto a first rigid carrier wafer with a first intermediate layer consisting of one first adhesion layer applied at least on the edge side,processing a second side of the product wafer,bonding of the product wafer with its second side on a second rigid carrier wafer with a second intermediate layer consisting of one second adhesion layer applied at least on the edge side, characterized in that the first intermediate layer and the second intermediate layer are made different such that the first carrier wafer can be separated selectively before the second carrier wafer.

主权项

1. Method for producing a product wafer, the method including steps of:
bonding a first side of the product wafer to a first rigid carrier wafer with a first intermediate layer, the first intermediate layer including one first adhesion layer applied at least on the edge side of the first side of the product wafer, the first adhesion layer made of a first material, processing a second side of the product wafer opposite to the first side by application of chips to the second side, bonding the second side of the product wafer to a second rigid carrier wafer with a second intermediate layer, the second intermediate layer including:
one second adhesion layer applied at least on the edge side of the second side of the product wafer, the second adhesion layer being made of a second material wherein the first adhesion layer and the second adhesion layer are made from different materials such that both rigid carrier wafers bonded to the product wafer can be separated selectively from the product wafer, after both the first rigid carrier wafer and the second rigid carrier wafer are bonded to the product wafer, applying a first force to the combination of the first rigid carrier wafer, the second rigid carrier wafer and the product wafer wherein the first rigid carrier wafer and the first intermediate layer are separated from the product wafer, and after the first rigid carrier wafer and the first intermediate layer are separated from the product wafer, applying a second force to the second rigid carrier wafer wherein the second rigid carrier wafer and the second intermediate layer are separated from the product wafer.