CMP slurry/method for polishing ruthenium and other films

摘要

A method and associated composition for CMP processing of noble metal-containing substrates (such as ruthenium-containing substrates) afford both high removal rates of the noble metal and are tunable with respect to rate of noble metal removal in relation to removal of other films. Low levels of an oxidizing agent containing one or more peroxy-functional group(s) can be used along with a novel ligand to effectively polish noble metal substrates.

主权项

1. A method for chemical mechanical planarization of a surface having at least one feature thereon comprising a noble metal, said method comprising the steps of:
A) placing a substrate having the surface having the at least one feature thereon comprising the noble metal in contact with a polishing pad; B) delivering a polishing composition having a pH which is basic, comprising:
a) an abrasive;b) a cyanate salt; andc) an oxidizing agent containing at least one peroxy-functional group; and C) polishing the substrate with the composition.