| 发明名称 | LED lighting apparatus | ||
| 摘要 | An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads. | ||
| 申请公布号 | US9222625(B2) | 申请公布日期 | 2015.12.29 |
| 申请号 | US201314037614 | 申请日期 | 2013.09.26 |
| 申请人 | Rohm Co., Ltd. | 发明人 | Horio Tomoharu;Ono Teruki |
| 分类号 | F21K99/00;H01L25/075;H05K3/28;F21S8/02;F21V3/02;F21Y101/02;F21Y105/00;F21V23/00;H01L33/64;H05K1/03;F21V29/74;F21V29/89 | 主分类号 | F21K99/00 |
| 代理机构 | Hamre, Schumann, Mueller & Larson, P.C. | 代理人 | Hamre, Schumann, Mueller & Larson, P.C. |
| 主权项 | 1. An LED lighting apparatus comprising: a board having a principal surface; a plurality of LED chips mounted on the principal surface of the board; a wiring pattern formed on the principal surface of the board, and configured to make an electrical conduction with the plurality of LED chips; and a frame-like bank provided on the principal surface of the board, and configured to surround the plurality of LED chips, wherein the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips, and the LED lighting apparatus further comprises a protective layer covering at least a portion of the pads and arranged to be spaced apart from the plurality of LED chips at a predetermined distance. | ||
| 地址 | Kyoto JP | ||