发明名称 Liquid processing method
摘要 A liquid processing method is provided for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution. In the intermediate process, an intermediate processing solution having a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution is supplied only to a rear surface of the substrate.
申请公布号 US9224624(B2) 申请公布日期 2015.12.29
申请号 US201414580787 申请日期 2014.12.23
申请人 TOKYO ELECTRON LIMITED 发明人 Inada Takao;Okamura Naoyuki;Yano Hidetsugu;Hachiya Yosuke
分类号 B08B7/00;B08B3/00;B08B7/04;H01L21/67 主分类号 B08B7/00
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A liquid processing method for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a first rinse solution and a second rinse solution having a temperature lower than a temperature of the processing solution, the method comprising: performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the second rinse solution and lower than the temperature of the processing solution, wherein, in the intermediate process, an intermediate processing solution having a temperature higher than the temperature of the second rinse solution and lower than the temperature of the processing solution is supplied only to a rear surface of the substrate, and in the rinse process, the first rinse solution having a temperature substantially equal to the temperature of the intermediate processing solution is supplied to the front surface of the substrate and, then, the second rinse solution having a temperature lower than the temperature of the intermediate processing solution is supplied to the front surface of the substrate.
地址 Tokyo JP