Solder alloy, solder paste, and electronic circuit board

摘要

A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.

主权项

1. A tin-silver-copper solder alloy consisting of:
tin, silver, copper, nickel, antimony, bismuth, and indium, and comprising no germanium except for a trace amount thereof contained as an unavoidable impurity, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, the copper content is 0.1 mass % or more and 1 mass % or less, the nickel content is 0.01 mass % or more and 0.2 mass % or less, the antimony content is 0.01 mass % or more and less than 2.5 mass %, the bismuth content is 0.01 mass % or more and 4 mass % or less, the indium content is 0.005 mass % or more and 2 mass % or less, the tin content is the remaining content, and a mass ratio of the copper content to the nickel content (Cu/Ni) is less than 12.5.