| 发明名称 | Printed circuit board | ||
| 摘要 | A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via. | ||
| 申请公布号 | US9226388(B2) | 申请公布日期 | 2015.12.29 |
| 申请号 | US201313955474 | 申请日期 | 2013.07.31 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Lee Sang-Kyung;Lee Hee-Kyoung;Lee Dong-Hwan;Lim Kyung-Sang |
| 分类号 | H05K9/00;H05K1/03;H05K1/11;H05K1/02 | 主分类号 | H05K9/00 |
| 代理机构 | NSIP Law | 代理人 | NSIP Law |
| 主权项 | 1. A printed circuit board, comprising: an insulation layer having multiple layers of circuit wirings formed therein; a via made of a metallic material, formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in a cylindrical shape and having a hollow inside; and an electromagnetic wave absorbing part contained in the hollow inside of the via, wherein the electromagnetic wave absorbing part is in direct contact with the metallic via material. | ||
| 地址 | Suwon-si KR | ||