发明名称 |
Endpointing with selective spectral monitoring |
摘要 |
A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. |
申请公布号 |
US9221147(B2) |
申请公布日期 |
2015.12.29 |
申请号 |
US201213658737 |
申请日期 |
2012.10.23 |
申请人 |
Applied Materials, Inc. |
发明人 |
Qian Jun;Dhandapani Sivakumar;Cherian Benjamin;Osterheld Thomas H.;David Jeffrey Drue;Menk Gregory E.;Swedek Boguslaw A.;Bennett Doyle E. |
分类号 |
G06F19/00;B24B37/013;B24B49/12 |
主分类号 |
G06F19/00 |
代理机构 |
Fish & Richardson P.C. |
代理人 |
Fish & Richardson P.C. |
主权项 |
1. A method of controlling polishing, comprising:
polishing a substrate; monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra; for each measured spectrum in the sequence of measured spectra, determining whether to include the measured spectrum as a selected spectrum based on at least one of
determining the presence or absence of a feature in the measured spectrum, ordetermining a position of a feature in the measured spectrum relative to a prior measured spectrum from the sequence of measured spectra,such that less than all of the measured spectra are selected to generate a sequence of selected spectra;
generating a sequence of values from the sequence of selected spectra; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. |
地址 |
Santa Clara CA US |