发明名称 Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
摘要 By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.
申请公布号 US9226406(B2) 申请公布日期 2015.12.29
申请号 US201013377998 申请日期 2010.06.04
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 Yamamoto Masamichi;Nakatsugi Kyouichirou;Okuda Yasuhiro
分类号 B32B9/04;H05K3/32;C09J9/02;H05K3/36;H05K3/28 主分类号 B32B9/04
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. An electrode connection method in which a first connecting electrode and a second connecting electrode are connected together through a conductive adhesive that is interposed between the electrodes, the method comprising: an organic film formation step in which an organic film is formed on at least a surface of the first connecting electrode by subjecting the surface of the first connecting electrode to a water-soluble preflux treatment; and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive, wherein, in the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.
地址 Osaka JP