发明名称 |
Rack mounted liquid submersion cooled electronic system |
摘要 |
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. |
申请公布号 |
US9223360(B2) |
申请公布日期 |
2015.12.29 |
申请号 |
US201213688815 |
申请日期 |
2012.11.29 |
申请人 |
LIQUIDCOOL SOLUTIONS, INC. |
发明人 |
Attlesey Chad D. |
分类号 |
G06F1/20;H05K5/06;H01L23/473;H05K7/20;F28D1/02;F28D15/02;F28F9/007 |
主分类号 |
G06F1/20 |
代理机构 |
Hamre, Schumann Mueller & Larson, P.C. |
代理人 |
Hamre, Schumann Mueller & Larson, P.C. |
主权项 |
1. A system, comprising:
a rack configured for receiving a plurality of electronic systems thereon, the rack having an inlet manifold and an outlet manifold; a plurality of electronic systems mounted on the rack in a horizontal array, each electronic system comprising:
a sealed case defining a liquid tight interior space, a fluid inlet in fluid communication with the interior space and fluidly connected to the inlet manifold, a fluid outlet in fluid communication with the interior space and fluidly connected to the outlet manifold, and a plurality of heat generating electronic devices disposed within the interior space;a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices; a heat exchanger mounted on the rack, the heat exchanger including an inlet in fluid communication with the outlet manifold and an outlet in fluid communication with the inlet manifold; a pump fluidly connected to the heat exchanger for pumping the single-phase, dielectric cooling liquid through the heat exchanger; and a liquid cooling system in heat exchange relationship with the heat exchanger. |
地址 |
Rochester MN US |