Printed circuit board and package substrate having additional conductive pathway space

摘要

In an embodiment, a printed circuit board includes a number of bond pads formed on a surface of the printed circuit board. At least a portion of the number of bond pads is arranged in an array of bond pads that includes a number of rows and a number of columns. A first portion of the number of rows include a number of adjacent rows having a first pitch and a second portion of the number of rows include at least one pair of adjacent rows having a second pitch different from the first pitch. In an embodiment, the second pitch is greater than 0.5 mm and less than 1.5 mm. In some embodiments, the array of bond pads can include at least one row of no-connect bond pads.

主权项

1. An apparatus comprising:
a printed circuit board including a number of bond pads formed on a surface of the printed circuit board, wherein
at least a portion of the bond pads are arranged in an array of bond pads,the array of bond pads has (i) a number of rows and (ii) a number of columns,respective bond pads of adjacent rows of the number of rows of the array of bond pads have a pitch of (i) at least 0.4 mm and (ii) no greater than 0.8 mm, andthe array of bond pads includes at least (i) a first row of no-connect bond pads and optionally (ii) a second row of no-connect bond pads.