发明名称 Image capturing module for reducing assembly tilt
摘要 An image capturing module for reducing assembly tilt includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip and downwardly contacts the image sensing chip. The actuator structure is disposed on the housing frame and above the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame. Whereby, the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.
申请公布号 US9225887(B1) 申请公布日期 2015.12.29
申请号 US201414455977 申请日期 2014.08.11
申请人 LITE-ON TECHNOLOGY CORPORATION 发明人 Hsu Po-Chih;Chan Chao-Yuan
分类号 H04N5/232;H04N5/225;G03B13/00 主分类号 H04N5/232
代理机构 Li & Cai Intellectual Property (USA) Office 代理人 Li & Cai Intellectual Property (USA) Office
主权项 1. An image capturing module for reducing assembly tilt, comprising: an image sensing unit including a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate; a housing frame disposed on the carrier substrate and downwardly contacting the image sensing chip, wherein the image sensing chip is surrounded by the housing frame; and an actuator structure disposed on the housing frame and above the image sensing chip, wherein the actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame; wherein the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.
地址 Taipei TW