发明名称 Multilayer ceramic electronic device and method for manufacturing the same
摘要 In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.
申请公布号 US9226400(B2) 申请公布日期 2015.12.29
申请号 US201313734266 申请日期 2013.01.04
申请人 Murata Manufacturing Co., Ltd. 发明人 Nomiya Masato;Sakai Norio;Nishide Mitsuyoshi
分类号 H05K1/03;H05K1/00;H05K1/16;H01R4/58;H05K7/10;H05K1/18;H01L21/48;H01L23/13;H01L23/15;H01L23/498;H01L23/00;H05K3/30;H05K3/46 主分类号 H05K1/03
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A multilayer ceramic electronic device in which a surface mount electronic device is mounted on a first principal surface of a multilayer ceramic element assembly, the multilayer ceramic electronic device comprising: a multilayer ceramic element assembly including laminated ceramic base material layers and a predetermined first conductor pattern; a seat portion arranged to mount the surface mount electronic device, the seat portion being disposed in at least a portion of the first principal surface of the multilayer ceramic element assembly, including a non-metallic inorganic powder as a primary component, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device; wherein the surface mount electronic device is mounted on the seat portion with the second conductor pattern extending therebetween; a resin is filled in at least the seat portion including the non-metallic inorganic powder as the primary component; the seat portion is defined by a porous ceramic compact including pores; the resin is provided in the pores of the porous ceramic compact; and the seat portion is disposed on and in direct contact with the first principal surface of the multilayer ceramic element assembly.
地址 Kyoto JP