THERMAL CONDUCTIVE POLYURETHANE RESIN

摘要

The present invention relates to a thermally conductive polyurethane resin having thermal conductivity greater than 0.2 W/mK as a reactant for organic diisocyanate groups, polyol groups, and chain extender groups. The thermally conductive polyurethane resin, according to the present invention, has excellent thermal conductivity and durability for manufacturing various heat resistant molded articles.