| 摘要 |
PROBLEM TO BE SOLVED: To appropriately perform bonding of a wire while reducing damages occurring on a semiconductor chip when directly performing stitch bonding on a chip pad of the semiconductor chip fixed on a substrate via a die mount material.SOLUTION: A semiconductor device manufacturing method comprises a stitch bonding process on a chip pad 21, which includes the following steps of: lowering a capillary 200 to a first predetermined height h1 while monitoring a height of the capillary; lowering the capillary 200 from the first predetermined height h1 until a load reaches a first predetermined load g1 where it is determined that the capillary 200 properly contacts the chip pad 21 while monitoring the load of the capillary 200 on the chip pad 21 and defining a height of the capillary 200 at the time of the first predetermined load g1 as a reference height h2; and lowering the capillary 200 from the reference height h2 with ultrasonic vibration while monitoring the height of the capillary 200 to bond a wire 40 to the chip pad 21. |
