| 发明名称 |
IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME |
| 摘要 |
In an image sensor module, a board may be provided with an accommodating groove and an image sensor may be disposed in the accommodating groove to decrease a space occupied by the image sensor. In addition, a side wall of the accommodating groove may be provided as an inclined surface and a bonding pad may be formed on the inclined surface to decrease a length of a bonding wire for electrically connecting the image sensor and the board to each other, whereby the overall size of the image sensor module may be decreased. |
| 申请公布号 |
US2015373239(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414485507 |
申请日期 |
2014.09.12 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Choi Kyung Hoon |
| 分类号 |
H04N5/225;G02B5/20 |
主分类号 |
H04N5/225 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensor module comprising:
an image sensor; and a board including an accommodating groove in which the image sensor is accommodated, wherein a side wall of the accommodating groove is provided as an inclined surface, and a bonding pad provided on the inclined surface and a bonding pad provided on the image sensor are connected to each other by a bonding wire. |
| 地址 |
Suwon-Si KR |
