Nanoscale Interconnects Fabricated by Electrical Field Directed Assembly of Nanoelements

摘要

The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanotubes.

主权项

1. A method of fabricating a nanoscale interconnect by electrical field directed assembly of nanoelements, the method comprising the steps of:
(a) providing a nanosubstrate comprising a base layer, a conductive layer deposited onto the base layer, and an insulating layer deposited onto the conductive layer, the insulating layer comprising a via, the via forming a void in the insulating layer and defining a pathway through the insulating layer that exposes the conductive layer; (b) immersing the nanosubstrate in an aqueous suspension of nanoelements; (c) applying an electrical field between the conductive layer and an electrode in the aqueous suspension, the electrical field consisting of the sum of a DC voltage and an AC voltage; and (d) withdrawing the nanosubstrate from the aqueous suspension while continuing to apply an electrical field between the conductive layer and the suspension electrode; whereby nanoelements from the suspension migrate into the via to form a nanoscale interconnect having an electrical connection with the conductive layer.