| 发明名称 |
CHIP COIL COMPONENT |
| 摘要 |
A chip coil component may include: a ceramic body including a plurality of first to fourth insulating layers, and an internal coil including a first internal pattern part having the plurality of first insulating layers on which first pattern portions are disposed and a second internal pattern part having the plurality of second insulating layers on which second pattern portions are disposed. The first pattern portions disposed on the plurality of first insulating layers are disposed to correspond to each other and are connected to each other by two first connection terminals each having one via electrode, and the second pattern portions disposed on the plurality of second insulating layers are disposed to correspond to each other and are connected to each other by two second connection terminals each having one via electrode. |
| 申请公布号 |
US2015371753(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414489030 |
申请日期 |
2014.09.17 |
| 申请人 |
Samsung Electro-Mechanics CO., LTD. |
发明人 |
LEE Jung Chul |
| 分类号 |
H01F27/28;H01F27/29 |
主分类号 |
H01F27/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip coil component, comprising:
a ceramic body including a plurality of first to fourth insulating layers; and an internal coil including a first internal pattern part having the plurality of first insulating layers on which first pattern portions are disposed and a second internal pattern part having the plurality of second insulating layers on which second pattern portions are disposed, wherein the first pattern portions disposed on the plurality of first insulating layers are disposed to correspond to each other and are connected to each other by two first connection terminals each having one via electrode, and the second pattern portions disposed on the plurality of second insulating layers are disposed to correspond to each other and are connected to each other by two second connection terminals each having one via electrode. |
| 地址 |
Suwon-Si KR |
