| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding head for bonding a die onto a substrate and a die boding device including the bonding head.SOLUTION: A bonding head includes: a body attached to a drive part for transferring a die; a plate-like heater attached to a lower part surface of the body; a collet which is attached to a lower part surface of the heater and holds the die with an air pressure; and at least one cooling pipe which penetrates through the body and to which a refrigerant for cooling the heater is provided. |
