SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To detect where a crack is generated in a semiconductor device having through electrodes.SOLUTION: A semiconductor device comprises: a first wire 41; a plurality of through electrodes TSV arranged along the first wire 41 and penetrating a semiconductor substrate; a second wire 42 to which a ground potential VSS is supplied; a plurality of resistor circuits 50-53 connected in parallel to each other between the first wire 41 and the second wire 42; a comparison circuit 45 having one input terminal connected to one end of the first wire 41; and a voltage generation circuit 46 connected to the other input terminal of the comparison circuit 45 and supplying a reference voltage VREF to the comparison circuit 45. The present invention makes it possible to easily identify where a crack is generated around the through electrodes.