发明名称 金属めっきされたTi材の製造方法および多孔質電極の製造方法
摘要 <p>PROBLEM TO BE SOLVED: To prevent the mixing of another treating solution into a plating solution, which causes a change in the properties of the plating solution and reduction in the strength of a plated film, and to enhance the adhesion strength of the plated film in a metal-plated Ti-material.SOLUTION: A method for producing a metal-plated Ti material includes: a first step for performing degreasing by immersing a base Ti material into a degreasing solution; a second step for cleaning the Ti material passed through the first step with water; a third step for immersing the Ti material passed through the second step into an acidic aqueous solution; a fourth step for cleaning the Ti material passed through the third step with water, a fifth step for immersing the Ti material passed through the fourth step into an etching solution; a sixth step for cleaning the Ti material passed through the fifth step with water; a seventh step for immersing the Ti material passed through the sixth step into an acidic aqueous solution; an eighth step for cleaning the Ti material passed through the seventh step with water; and a ninth step for immersing the Ti material passed through the eighth step into an aqueous solution containing a metal salt and performing electroplating.</p>
申请公布号 JP5836985(B2) 申请公布日期 2015.12.24
申请号 JP20130030577 申请日期 2013.02.20
申请人 三菱電機株式会社 发明人 川下 竜太;増田 暁雄
分类号 C25D5/38;C25B11/03;C25B11/10;C25D5/28 主分类号 C25D5/38
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