SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

A semiconductor light emitting device package includes a semiconductor laminate having first and second surfaces and side surfaces, and including first and second conductivity-type semiconductor layers, and an active layer, a support body disposed on the second surface and including first and second package electrodes, a first electrode layer disposed on the first surface and connected to the first conductivity-type semiconductor layer and extended along a side of the semiconductor laminate to be connected to the first package electrode, a side insulating layer disposed on a side of the semiconductor laminate and electrically insulating the first electrode layer from the side of the semiconductor laminate, and a second electrode layer disposed on the second surface and electrically connecting the first conductivity-type semiconductor layer to the second package electrode.

主权项

1. A semiconductor light emitting device package, comprising:
a semiconductor laminate having a first surface and a second surface disposed opposite to each other, and a side surface connecting the first and second surfaces, and including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer forming the first surface and the second surface, respectively, and an active layer disposed between the first and second conductivity-type semiconductor layers; a support body disposed on the second surface of the semiconductor laminate and including a first package electrode and a second package electrode; a first electrode layer disposed on the first surface of the semiconductor laminate to be connected to the first conductivity-type semiconductor layer and extending along the side surface of the semiconductor laminate to be connected to the first package electrode; a side insulating layer disposed on the side surface of the semiconductor laminate and electrically insulating the first electrode layer from the side surface of the semiconductor laminate; and a second electrode layer disposed between the second surface of the semiconductor laminate and the second package electrode and electrically connecting the first conductivity-type semiconductor layer to the second package electrode.