Method and Apparatus for Laser Cutting Transparent and Semitransparent Substrates

摘要

The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.

主权项

1. A method of laser cutting transparent and semi-transparent substrates, comprising:
positioning at least one substrate on a work surface; outputting at least one pulsed laser signal from a pulsed laser system; adjusting at least one power profile of the laser signal to form at least one cutting signal configured to form micro-fractures within the substrate; directing the cutting signal to the substrate; forming multiple micro-fractures within the substrate with the cutting signal, the micro-fractures formed between a first surface and second surface of the substrate, the multiple micro-fractures forming at least one cut line in a desired shape within the substrate; and separating the substrate along at least one desired cut line.