| 摘要 |
1,131,319. Thermosetting adhesive; particle board. CANADIAN INDUSTRIES Ltd. 21 Nov., 1966 [27 Nov., 1965], No. 52018/66. Headings C3N and C3R. An adhesive composition for the fabrication of particle board comprises the non-cellular reaction product of an organic polyisocyanate, a resinous hydroxyl group-containing material derived from pine wood and containing about 14% by weight of hydrocarbons, 26% by weight of resin acids and 60% by weight of phenolic material, and a basic catalyst. When used to fabricate the particle board, the adhesive composition is employed in proportion of 5 to 25% by weight of wood particles and the basic catalyst is employed in proportions of 0À1 to 7À0% by weight of the wood particles. In examples, the polyisocyanate used is 4,4<SP>1</SP>- diphenylmethane diisocyanate and catalysts used are diethylene triamine and a mixture of triethanolamine and N,N-dimethyl cyclohexylamine. The adhesive is suitably dissolved in a solvent, e.g. acetone and sprayed over the wood shavings and the coated shavings placed in a press to produce particle board. |
