发明名称 FLEXURE SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH HEAD, AND HARD DISK DRIVE
摘要 PROBLEM TO BE SOLVED: To provide a flexure substrate for suspension in which warp generated in a longitudinal direction of wiring is reduced while accommodating an increasing number of wiring.SOLUTION: In a flexure substrate for suspension of a lamination wiring structure having a first wiring layer and a second wiring layer, a plurality of pieces of wiring connecting a gimbal part, which is provided for a part closer to a tip end part of a metal support substrate, to a terminal part for connection provided for a tail-side end part are disposed in the first wiring layer and the second wiring layer, and a larger number of pieces of wiring are distributed to the second wiring layer than the first wiring layer in the vicinity of the gimbal part or in the terminal part for connection, or in the vicinity of the gimbal part and in the terminal part for connection.
申请公布号 JP2015232919(A) 申请公布日期 2015.12.24
申请号 JP20150176144 申请日期 2015.09.07
申请人 DAINIPPON PRINTING CO LTD 发明人 HIRATA KENRO
分类号 G11B5/60;G11B21/21;H05K1/05 主分类号 G11B5/60
代理机构 代理人
主权项
地址