| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for enabling transfer of a shape in a transfer part on a semiconductor substrate surface without immersing the semiconductor substrate in a solution. <P>SOLUTION: A semiconductor manufacturing apparatus transferring a shape in a transfer part on a semiconductor substrate surface arranges the transfer part acting as catalyst of the solution in vicinity to the surface of the inclined semiconductor substrate and supplies the solution to the semiconductor substrate surface so as to cause the solution to flow in vicinity to the semiconductor substrate surface at which the transfer part is arranged. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
