| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board which does not have large differences between heights of metal layers, having been subject to heating and melting treatments, on semiconductor element connection pads and always connects an electrode of a semiconductor element with the semiconductor element connection pads normally. <P>SOLUTION: A wiring board 10 includes: an insulation substrate 1 having a mounting part 1a at a center part on an upper surface; a number of semiconductor element connection pads 4 provided at an outer peripheral part of the mounting part 1a so as to form two lines, an inner side line and an outer side line; a solder resist layer 6 adhered to the upper surface of the insulation substrate 1 and having an opening 6a exposing the two line arrangement of the semiconductor element connection pads 4; an extraction wiring 3c which connects with the semiconductor element connection pads 4 on the inner side line and extends to the outer side of the mounting part 1a passing through the opening 6a; and metal layers 7 adhered to surfaces of the semiconductor element connection pads 4 and having been subject to heating and melting treatments. The extraction wiring 3c connects with the semiconductor element connection pads 4 under the solder resist layer 6 on the inner side relative to the opening 6a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
