| 发明名称 |
METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS |
| 摘要 |
A method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. Accordingly, the method can decrease the number of processes and realize a fine bump pitch of 90 μm or less at the time of forming bumps. Further, the method can also decrease the number of times that alignment is performed, due to the decrease in the number of processes. |
| 申请公布号 |
US2015373856(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201514842046 |
申请日期 |
2015.09.01 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
CHOI Cheol Ho;LEE Chang Bo;RYU Chang Sup |
| 分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for forming bumps, comprising:
coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. |
| 地址 |
Suwon-si KR |
