发明名称 |
METHOD OF FORMING A MEMORY AND METHOD OF FORMING A MEMORY ARRAY |
摘要 |
A method of forming a memory includes forming a first electrode and a second electrode within a first layer over a semiconductor substrate, forming a resistive-switching memory element and an antifuse element over the first layer, wherein the resistive-switching memory element includes a metal oxide layer and is electrically contacting the first electrode, wherein the metal oxide layer has a first thickness and a forming voltage that corresponds to the first thickness, wherein the antifuse element includes a dielectric layer and is electrically contacting the second electrode, and wherein the dielectric layer has a second thickness that is less than the first thickness and a dielectric breakdown voltage that is less than the forming voltage, and forming a third electrode and a fourth electrode within a second layer over the resistive-switching memory element and the antifuse element, wherein the third electrode is electrically contacting the resistive-switching memory element and the fourth electrode is electrically contacting the antifuse element. |
申请公布号 |
US2015372230(A1) |
申请公布日期 |
2015.12.24 |
申请号 |
US201514837029 |
申请日期 |
2015.08.27 |
申请人 |
Infineon Technologies AG |
发明人 |
KNOBLOCH KLAUS;STRENZ ROBERT |
分类号 |
H01L45/00;H01L27/24 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a memory, comprising:
forming a first electrode and a second electrode within a first layer over a semiconductor substrate; forming a resistive-switching memory element and an antifuse element over the first layer, wherein the resistive-switching memory element comprises a metal oxide layer and is electrically contacting the first electrode, wherein the metal oxide layer has a first thickness and a forming voltage that corresponds to the first thickness, wherein the antifuse element comprises a dielectric layer and is electrically contacting the second electrode, and wherein the dielectric layer has a second thickness that is less than the first thickness and a dielectric breakdown voltage that is less than the forming voltage; and forming a third electrode and a fourth electrode within a second layer over the resistive-switching memory element and the antifuse element, wherein the third electrode is electrically contacting the resistive-switching memory element and the fourth electrode is electrically contacting the antifuse element. |
地址 |
Neubiberg DE |