SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

In the present invention, a semiconductor wafer is prepared, said semiconductor wafer having a plurality of semiconductor chip regions, each of which is to be a semiconductor chip having a desired circuit formed on one surface, and cutting regions that are provided among the semiconductor chip regions. A modified layer is formed along the outer circumference of each of the semiconductor chip regions in each of the semiconductor chip regions, said modified layer reaching, from at least the inner portion of the semiconductor wafer, the other surface where no circuit is to be formed. Then, the semiconductor wafer is divided into a plurality of semiconductor chips by cutting the semiconductor wafer at the cutting regions.

主权项

1. A semiconductor device comprising:
a wiring board, and a semiconductor chip mounted on the wiring board, wherein the semiconductor chip comprises a modified layer which is formed along an outer periphery and which reaches at least from the interior to a surface on which a circuit is not formed.