发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
Semiconductor devices and methods for forming the same in which damages to a low-k dielectric layer therein can be reduced or even prevented are provided. A semiconductor device is provided, comprising a substrate. A dielectric layer with at least one conductive feature therein overlies the substrate. An insulating cap layer overlies the top surface of the low-k dielectric layer adjacent to the conductive feature, wherein the insulating cap layer includes metal ions. |
申请公布号 |
US2015371943(A1) |
申请公布日期 |
2015.12.24 |
申请号 |
US201514837458 |
申请日期 |
2015.08.27 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd |
发明人 |
SU Hung-Wen;CHOU Shih-Wei;TSAI Ming-Hsing |
分类号 |
H01L23/528;H01L21/285;H01L23/532 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate; a low-K dielectric layer on the semiconductor substrate; a conductive feature in the low-k dielectric layer, wherein the conductive feature comprises a diffusion barrier layer and a conductive layer; and a cap layer on the conductive feature, wherein the cap layer comprises oxide of the conductive layer. |
地址 |
Hsin-Chu TW |