发明名称 SEMICONDUCTOR DEVICE
摘要 Semiconductor devices and methods for forming the same in which damages to a low-k dielectric layer therein can be reduced or even prevented are provided. A semiconductor device is provided, comprising a substrate. A dielectric layer with at least one conductive feature therein overlies the substrate. An insulating cap layer overlies the top surface of the low-k dielectric layer adjacent to the conductive feature, wherein the insulating cap layer includes metal ions.
申请公布号 US2015371943(A1) 申请公布日期 2015.12.24
申请号 US201514837458 申请日期 2015.08.27
申请人 Taiwan Semiconductor Manufacturing Co., Ltd 发明人 SU Hung-Wen;CHOU Shih-Wei;TSAI Ming-Hsing
分类号 H01L23/528;H01L21/285;H01L23/532 主分类号 H01L23/528
代理机构 代理人
主权项 1. A semiconductor device, comprising: a semiconductor substrate; a low-K dielectric layer on the semiconductor substrate; a conductive feature in the low-k dielectric layer, wherein the conductive feature comprises a diffusion barrier layer and a conductive layer; and a cap layer on the conductive feature, wherein the cap layer comprises oxide of the conductive layer.
地址 Hsin-Chu TW