| 发明名称 |
HEAT RELEASING SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect. |
| 申请公布号 |
US2015371924(A1) |
申请公布日期 |
2015.12.24 |
| 申请号 |
US201414587205 |
申请日期 |
2014.12.31 |
| 申请人 |
Magnachip Semiconductor, Ltd. |
发明人 |
KIM Jo Han;PARK Hee Jin;KIM Kyeong Su;LEE Jae Jin |
| 分类号 |
H01L23/42;H01L21/56 |
主分类号 |
H01L23/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a heat releasing semiconductor chip package, the method comprising:
attaching a first surface of a semiconductor chip onto an insulating film; injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer; and curing the liquefied coating layer to form a heat releasing layer, wherein the coating liquid comprises a liquefied molding compound for heat releasing and fine alumina particles. |
| 地址 |
Cheongju-si KR |
