METHODS AND SYSTEMS FOR CHEMICAL MECHANICAL PLANARIZATION ENDPOINT DETECTION USING AN ALTERNATING CURRENT REFERENCE SIGNAL

摘要

Methods, non-transitory computer readable media, and systems are provided for detecting an endpoint of a chemical mechanical planarization (CMP) process on a semiconductor substrate. The method comprises generating a reference signal, generating a first signal with which to control a CMP system, generating a second signal using a combination of the first signal and the reference signal, commanding the CMP system with the second signal, generating a response signal that indicates an operational characteristic of the CMP system that is responsive to the second signal and a friction property of the semiconductor substrate, and filtering the response signal using the reference signal to determine the endpoint of the CMP process.

主权项

1. A method for detecting an endpoint of a chemical mechanical planarization (CMP) process on a semiconductor substrate, the method comprising:
generating a reference signal; generating a first signal with which to control a CMP system; generating a second signal using a combination of the first signal and the reference signal; commanding the CMP system with the second signal; generating a response signal that indicates an operational characteristic of the CMP system that is responsive to the second signal and a friction property of the semiconductor substrate; and filtering the response signal using the reference signal to determine an endpoint of the CMP process.