发明名称 Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device
摘要 The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.
申请公布号 US2015368554(A1) 申请公布日期 2015.12.24
申请号 US201414767717 申请日期 2014.02.13
申请人 DOW CORNING TORAY CO., LTD. 发明人 Sagawa Takashi;Amako Masaaki;Itoh Maki;Suto Michitaka;Iimura Tomohiro
分类号 C09K11/02;H01L33/56;H01L33/50;C09D183/04;C09J183/04 主分类号 C09K11/02
代理机构 代理人
主权项 1. A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, and excluding component (B) mentioned below; (B) an organopolysiloxane represented by the general formula: wherein, R1 are the same or different and are each an alkenyl group having from 2 to 12 carbons, R2 are the same or different and are each an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons, R3 are the same or different and are each an alkyl group having from 1 to 12 carbons, and p is an integer from 1 to 100; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount that the amount of silicon-bonded hydrogen atoms in component (C) is from 0.1 to 5 moles per 1 mol of total alkenyl groups in components (A) and (B); (D) a phosphor; and (E) an effective amount of a hydrosilylation reaction catalyst; the content of component (A) being from 20 to 80 mass %, the content of component (B) being from 0.1 to 20 mass % and the content of component (D) being from 0.1 to 70 mass %, each relative to the total amount of components (A) to (E).
地址 Tokyo JP
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