发明名称 |
ANTICORROSIVE, TERMINAL-ATTACHED COVERED ELECTRIC WIRE, AND WIRING HARNESS |
摘要 |
Provided is an anticorrosive containing a curable resin composition and that has a high anticorrosive capability and a good adhesion to an oily surface, and a terminal-attached covered electric wire and a wiring harness using the anticorrosive. The terminal-attached covered electric wire has a contact portion where a wire conductor of a covered electric wire and a connection terminal contact each other. The contact portion is covered with the anticorrosive. The wiring harness contains the terminal-attached covered electric wire. The curable resin composition contains 100 parts by mass of a polymer of a (meth)acrylate monomer, the polymer having two or more (meth)acrylate groups, 40 to 90 parts by mass of isobornyl (meth)acrylate, and 1 to 15 part by mass of an alkyl (meth)acrylate represented by formula 1, where R1 is either H or CH3, and R2 is an alkyl group having a carbon number of 8 to 13,; |
申请公布号 |
US2015368389(A1) |
申请公布日期 |
2015.12.24 |
申请号 |
US201414760140 |
申请日期 |
2014.10.03 |
申请人 |
AUTONETWORKS TECHNOLOGIES, LTD. ;SUMITOMO WIRING SYSTEMS, LTD. ;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
TANAKA Shigeyuki;RACHI Hironobu;OSHIUMI Naoyuki;ITO Kenji;TAKADA Takashi |
分类号 |
C08F265/06;H01R43/02;H01B1/02;H01R4/02;H01B7/00;H01B7/28 |
主分类号 |
C08F265/06 |
代理机构 |
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代理人 |
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主权项 |
1. An anticorrosive adapted to cover a contact portion of a terminal-attached covered electric wire where a wire conductor of a covered electric wire and a connection terminal is in contact with each other, the anticorrosive comprising a curable resin composition that comprises, as main ingredients:
(A) 100 parts by mass of a polymer of a (meth)acrylate monomer, the polymer having two or more (meth)acrylate groups; (B) 40 to 90 parts by mass of isobornyl (meth)acrylate; and (C) 1 to 15 part by mass of an alkyl (meth)acrylate represented by formula 1, where R1 is either H or CH3, and R2 is an alkyl group having a carbon number of 8 to 13, |
地址 |
Yokkaichi-shi, Mie JP |