发明名称 基板周縁部の塗布膜除去方法、基板処理装置及び記憶媒体
摘要 <p>A method of removing a coating film of a substrate peripheral portion, is provided with holding and supporting a circular substrate by allowing a transfer body to transfer a rear surface of the substrate to a supporting part; removing a coating film in the shape of a ring by a predetermined width size by supplying a solvent from a solvent nozzle to a peripheral portion of the coating film formed on the surface of the substrate; transferring the substrate to an inspection module for inspecting a state of the coating film by imaging the entire surface of the substrate; detecting a removal region of the coating film based on image data acquired by the inspection module; and correcting a delivery position of a succeeding substrate with respect to the supporting part by the transfer body based on the detection result of the removal region of the coating film.</p>
申请公布号 JP5835188(B2) 申请公布日期 2015.12.24
申请号 JP20120244310 申请日期 2012.11.06
申请人 東京エレクトロン株式会社 发明人 富田 浩;久野 和哉
分类号 B05D3/00;G03F7/42;H01L21/027 主分类号 B05D3/00
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